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  Datasheet File OCR Text:
 FLASH NOR HIGH DENSITY & CONSUMER
M29DWxxx FAMILY Multiple Bank
May, 2004
HD & Cons. Division -VAM29DW.ppt - ptfl0402-504
STMicroelectronics
www.st.com/flash
Family Overview
Densities from 32Mb to 64Mb Wide application area covered 0.15m process technology
technology shrink on going
higher densities improved performances Increased reliability
HD & Cons. Division - May, 2004 M29DW.ppt - release 1.0 -ptfl0402-504-
www.st.com/flash
page 2
Main Features
M29DW323
32Mb (4Mbx8 / 2Mbx16), Boot Block Access Time 70, 90ns Supply Voltage Vcc = 2.7V to 3.6V for Program, Erase and Read Vpp = 12V for fast Program (optional) Programming Time 10s per Byte/Word typical Double Word / Quadruple Byte Program Low Power Consumption Standby and Automatic Standby Dual Operations: Read in one bank or group of banks while Program or Erase in the other
HD & Cons. Division - May, 2004 M29DW.ppt - release 1.0 -ptfl0402-504-
www.st.com/flash
page 3
Bank Architecture
M29DW323
DUAL BANK Memory Array 8Mb + 24Mb
While Programming or Erasing in Bank A, Read operations are possible in Bank B and viceversa
HD & Cons. Division - May, 2004 M29DW.ppt - release 1.0 -ptfl0402-504-
www.st.com/flash
page 4
Main Features
M29DW324
32Mb (4Mbx8 / 2Mbx16), Boot Block Access Time 70, 90ns Supply Voltage Vcc = 2.7V to 3.6V for Program, Erase and Read Vpp = 12V for fast Program (optional) Programming Time 10s per Byte/Word typical Double Word / Quadruple Byte Program Low Power Consumption Standby and Automatic Standby
HD & Cons. Division - May, 2004 M29DW.ppt - release 1.0 -ptfl0402-504-
www.st.com/flash
page 5
Bank Architecture
M29DW324
DUAL BANK Memory Array 16Mb + 16Mb
While Programming or Erasing in Bank A, Read operations are possible in Bank B and viceversa
HD & Cons. Division - May, 2004 M29DW.ppt - release 1.0 -ptfl0402-504-
www.st.com/flash
page 6
Main Features
M29DW640
64Mb (8Mbx8 / 4Mbx16), Page, Boot Block Access Time 70, 90ns Supply Voltage Vcc = 2.7V to 3.6V for Program, Erase and Read Vpp = 12V for fast Program (optional) Programming Time 10s per Byte/Word typical 4 word / 8Bytes at-a-time Program Asynchronous Page Read Mode Page Width 4 Words Page Access 25,30ns Random Access 70,90ns
HD & Cons. Division - May, 2004 M29DW.ppt - release 1.0 -ptfl0402-504-
www.st.com/flash
page 7
Bank Architecture
M29DW640
QUADRUPLE BANK Memory Array 8Mb + 24Mb + 24Mb + 8Mb
While Programming or Erasing in a group of Banks (from 1 to 3), Read operations are possible in any of the other banks
HD & Cons. Division - May, 2004 M29DW.ppt - release 1.0 -ptfl0402-504-
www.st.com/flash
page 8
Other Family Features
Temporary block unprotection mode Unlock bypass Program Command faster production/batch programming Extended memory block Extra block used as security block or to store additional information Common Flash Interface 64 bit security code M29DW323/324: Erase suspend and resume modes Read and program another block during erase suspend M29DW640: Program /Erase suspend and resume modes Read from any block during program suspend Read and program another block during erase suspend 100,000 program / erase cycles per block
HD & Cons. Division - May, 2004 M29DW.ppt - release 1.0 -ptfl0402-504-
www.st.com/flash
page 9
TSOP48 Package
Package connections Package Mechanical
TSOP48 Lead Plastic Thin Small Outline 12x20mm Bottom View Package Outline
M29DW323 M29DW324 M29DW640
HD & Cons. Division - May, 2004 M29DW.ppt - release 1.0 -ptfl0402-504-
www.st.com/flash
page 10
TFBGA48 Package
Package connections
Top view through package
Package Mechanical
6x8mm -6x8 Ball Array, 0.8mm pitch Bottom View Package Outline
M29DW323 M29DW324
HD & Cons. Division - May, 2004 M29DW.ppt - release 1.0 -ptfl0402-504-
www.st.com/flash
page 11
Part Numbering Scheme ex. M29DW640D
Speed Device Function
640D= 64Mb (x8/x16), Boot Block 8+24+24+8 partitioning 70 = 70ns 90 = 90ns
Package
N = TSOP48, 12x20mm ZA = TFBGA63, 7x11mm, 0.80mm pitch
M29
D
W
640D
70 N
1
T
Architecture
D = Dual Operations
Temperature Range
1 = 0 to 70 C 6 = -40 to + 85C
Device Type
M28
Option Operating Voltage
W = Vcc = 2.7V to 3.6V Blank = Standard Packing T = Tape & Reel Packing 24mm E = Lead Free Package, Standard Packing F = Lead Free Package, Tape & Reel Packing
HD & Cons. Division - May, 2004 M29DW.ppt - release 1.0 -ptfl0402-504-
www.st.com/flash
page 12
Main Applications
Mobile Phone Digital Video Disk Personal Digital Assistant Set-Top Box Digital Still Camera High Definition TV Personal Computer Game
HD & Cons. Division - May, 2004 M29DW.ppt - release 1.0 -ptfl0402-504-
www.st.com/flash
page 13
Future Developments
New State of the Art technology shrink on going Higher densities soon available Improved performances Stand Alone and Stacked solutions
HD & Cons. Division - May, 2004 M29DW.ppt - release 1.0 -ptfl0402-504-
www.st.com/flash
page 14
Additional Information
www.st.com/flash
Datasheets Application Notes Software Drivers Presentations Technical Articles ...and more...
ask.memory@st.com
HD & Cons. Division - May, 2004 M29DW.ppt - release 1.0 -ptfl0402-504-
www.st.com/flash
page 15


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